Microelectronic devices and methods for manufacturing microelectronic devices
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United States of America Patent
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Oct 6, 2015
Grant Date -
Nov 13, 2014
app pub date -
Dec 9, 2013
filing date -
Aug 30, 2006
priority date (Note) -
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Abstract
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. One such method includes forming a plurality of apertures in a substrate with the apertures arranged in an array, and, after forming the apertures, attaching the substrate to a lead frame having a plurality of pads with the apertures in the substrate aligned with corresponding pads in the lead frame. Another method includes providing a partially cured substrate, coupling the partially cured substrate to a plurality of leads, attaching a microelectronic die to the leads, and electrically connecting the microelectronic die to the leads.
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