Interconnect with hybrid metallization
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United States of America Patent
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Jun 16, 2015
Grant Date -
Nov 13, 2014
app pub date -
May 9, 2013
filing date -
May 9, 2013
priority date (Note) -
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Abstract
An electronic interconnect structure having a hybridized metal structure near regions of high operating temperature on an integrated circuit, and methods of making the same. The hybridized metal structure features at least two different metals in a single metallization level. The first metal is in a region of high operating temperature and the second region is in a region of normal operating temperatures. In a preferred embodiment the first metal includes aluminum and is in a first level metallization over an active area of the device while the second metal includes copper. In some embodiments, the first and second metals are not in direct physical contact. In other embodiments the first and second metals physically contact each other. In a preferred embodiment, a top surface of the first metal is not co-planar with a top surface of the second metal, despite being in the same metallization level.
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