CYANATE ESTERS-BASED ADHESIVE RESIN COMPOSITION FOR FABRICATION OF CIRCUIT BOARD AND FLEXIBLE METAL CLAD LAMINATE COMPRISING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 13, 2014
app pub date -
Dec 11, 2012
filing date -
Dec 12, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to an adhesive resin composition for fabrication of circuit boards and its use. The adhesive resin composition of the present invention includes a cyanate ester resin, a fluorine-based resin powder dispersed in the cyanate ester resin, and a rubber component and has low dielectric constant and low dielectric loss factor, which enables the fabrication of circuit boards with further enhanced electrical characteristics.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully