Semiconductor defect characterization

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9437506
APP PUB NO 20140335631A1
SERIAL NO

14271331

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Abstract

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The defect-containing die identified from an inspection layer analysis subsequent to a manufacturing step for a wafer including a plurality of die and as well as the faulty die identified from a fault testing of the wafer are processed to identify a subset of the die that both contain a defect and are faulty. A probability analysis is performed to determine a confidence level of whether the die in the subset are faulty due to their defects.

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Patent Owner(s)

  • LATTICE SEMICONDUCTOR CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Wendy Portland, US 23 209
Hessinger, Uwe Portland, US 1 1
Schafman, Brett Portland, US 1 1

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