FLAKE-FORM CONDUCTIVE FILLER
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United States of America Patent
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Nov 20, 2014
app pub date -
Jan 10, 2013
filing date -
Jan 20, 2012
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Abstract
The present invention provides a flake-form conductive filler which is easy and low-cost to produce and has a high conductivity. The flake-form conductive filler of the present invention includes a flake-form base material and a silver coating covering the entire surface of the flake-form base material. The flake-form base material contains copper. The flake-form conductive filler has a ratio a/b between a peak intensity “a” derived from a silver (111) plane and a peak intensity “b” derived from a silver (220) plane at 2 or less in the powder X-ray diffraction measurement.
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