PATTERN FORMATION METHOD AND PATTERN FORMATION APPARATUS
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United States of America Patent
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Issued Date -
Nov 20, 2014
app pub date -
Aug 21, 2013
filing date -
May 20, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
According to one embodiment, a pattern formation method includes preparing a mold including a first pattern, preparing a substrate including a second pattern, coating a photosensitive resin onto the substrate, bringing the mold into contact with the photosensitive resin, determining whether or not the photosensitive resin is filled between the first pattern and the second pattern, performing an alignment of the first pattern and the second pattern according to a first reference in the case where the photosensitive resin is filled between the first pattern and the second pattern, and performing the alignment of the first pattern and the second pattern according to a second reference different from the first reference in the case where the photosensitive resin is not filled between the first pattern and the second pattern, curing the photosensitive resin, and releasing the mold from the photosensitive resin.
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