HEAT DISSIPATION PLATE
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United States of America Patent
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N/A
Issued Date -
Nov 27, 2014
app pub date -
Jul 5, 2013
filing date -
May 21, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipation plate including a heat-conductive material layer, a first metal layer, a metal substrate, and a metal ring frame is provided. The heat-conductive material layer has an upper surface and a lower surface opposite to each other. A material of the heat-conductive material layer includes ceramic or silicon germanium. The first metal layer is disposed on the lower surface of the heat-conductive material layer and has a first rough surface structure. The metal substrate is disposed below the first metal layer and has a second rough surface structure. The metal ring frame is disposed between the first metal layer and the metal substrate. The first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber.
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