Reducing dielectric loss in solder masks

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United States of America Patent

PATENT NO 9526180
APP PUB NO 20140345923A1
SERIAL NO

13995667

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Abstract

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A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miller, Dennis J Sherwood, US 45 1146

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