PLANARIZATION METHOD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 27, 2014
app pub date -
May 14, 2014
filing date -
May 22, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of planarizing a member is provided. The method includes forming the member and polishing a top face of the member. The forming the member includes forming a resist layer which varies in thickness and performing an etch-back process. The etch-back process removes the resist layer and adjusts amounts to be removed by the polishing from respective locations of the member.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully