MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
Stats
-
N/A
Issued Date -
Dec 4, 2014
app pub date -
Jan 12, 2014
filing date -
May 29, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A multilayer circuit board includes a wiring board, a first adhesive sheet, an electronic device, and a second adhesive sheet. The wiring board includes a first wiring layer and a second wiring layer. The first adhesive sheet is adjacent to the first wiring layer. The first adhesive sheet defines a second receiving hole. The second receiving hole and the first receiving hole cooperatively form a receiving cavity. The first adhesive sheet includes a supporting surface. The electronic device is received in the receiving cavity, and includes two electrodes. The second adhesive sheet is adjacent to the second wiring layer, and includes a bottom surface. The third wiring layer is formed on the supporting surface and contacts with the two electrodes. The fourth wiring layer is formed on the bottom surface.
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Cited Art Landscape
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