Local interconnects by metal-III-V alloy wiring in semi-insulating III-V substrates

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United States of America Patent

PATENT NO 8941123
SERIAL NO

13905894

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A structure and method of producing a semiconductor structure including a semi-insulating semiconductor layer, a plurality of isolated devices formed over the semi-insulating semiconductor layer, and a metal-semiconductor alloy region formed in the semi-insulating semiconductor layer, where the metal-semiconductor alloy region electrically connects two or more of the isolated devices.

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  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Basu,, Jr Anirban Elmsford, US 1 0
Cabral,, Jr Cyril Mahopac, US 92 768
Cohen, Guy Mohegan Lake, US 142 2945

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