COMPOSITION FOR HEAT INSULATOR, HEAT INSULATOR, AND SPACECRAFT EQUIPPED THEREWITH
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United States of America Patent
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Issued Date -
Dec 4, 2014
app pub date -
Jan 16, 2013
filing date -
Jan 17, 2012
priority date (Note) -
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Abstract
A composition for a heat insulator, a heat insulator, and a spacecraft equipped with the heat insulator are provided which are able to satisfy a desired level of heat insulation performance while suppressing recession. The composition for a heat insulator comprises a fibrous substance, inorganic foam particles, a thermosetting resin and a foaming agent, wherein the fibrous substance includes at least a first fibrous substance, and a second fibrous substance composed of a material different from the first fibrous substance, the melting point of the first fibrous substance is higher than the melting point of the second fibrous substance, and the thermal conductivity of the second fibrous substance is lower than the thermal conductivity of the first fibrous substance.
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