WAFER BONDING MISALIGNMENT REDUCTION
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United States of America Patent
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app pub date -
May 28, 2013
filing date -
May 28, 2013
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Abstract
A method for wafer bonding includes measuring grid distortion for a mated pairing of wafers to be bonded to determine if misalignment exists between the wafers. During processing of subsequent wafers, magnification of one or more lithographic patterns is adjusted to account for the misalignment. The subsequent wafers are bonded with reduced misalignment.
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