SEMICONDUCTOR DEVICE
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United States of America Patent
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app pub date -
Aug 15, 2014
filing date -
Jun 2, 2008
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Abstract
A semiconductor device includes a semiconductor chip and a metal layer electrically coupled to the semiconductor chip. The semiconductor device includes an array of solder balls coupled to the metal layer and a front side protect material directly contacting the metal layer and laterally surrounding a portion of at least a plurality of solder balls. The front side protect material is configured to become fluid during solder reflow.
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