Intraneural Implant

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United States of America Patent

APP PUB NO 20140358174A1
SERIAL NO

14372380

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An intraneural implant comprises a lead comprising a number of electrode wires, a number of electrodes communicatively coupled to the electrode wires, the electrodes forming an electrode array, and an overmold surrounding the electrode wires and at least a portion of the electrodes, and a blunt dissector tip coupled to the lead to penetrate nerve tissues as the electrode array is implanted. An intraneural implant system comprises a flexible lead. The flexible lead comprises a lead body, an electrode array communicatively coupled to the lead body, a blunt dissector tip to penetrate a nerve bundle as the electrode array is implanted into the nerve bundle, and an implantation tool coupled to the electrode array to implant the electrode array into the nerve bundle.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED BIONICS AG8712 STAEFA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Downing, Mark B Valencia, US 30 246
Thenuwara, Chuladatta Castaic, US 78 1400

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