Laser Diode Assembly
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United States of America Patent
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Issued Date -
Dec 11, 2014
app pub date -
Apr 29, 2014
filing date -
Apr 4, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A laser diode assembly includes a housing having a housing part and a mounting part, which is connected to the housing part and which extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 2 μm is arranged between the laser diode chip and the mounting part. The laser diode chip has a radiation coupling-out area, on which a crystalline protective layer is applied.
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