Processes for producing substrate for liquid ejection head
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United States of America Patent
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Aug 11, 2015
Grant Date -
Dec 11, 2014
app pub date -
May 21, 2014
filing date -
Jun 6, 2013
priority date (Note) -
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Abstract
A process for producing a substrate for a liquid ejection head, including a step of forming a liquid supply port passing through a silicon substrate by dry etching, the step being a step of sequentially repeating the steps of (1) forming an etching protection film on the silicon substrate, (2) removing a bottom portion of the etching protection film, and (3) etching the silicon substrate, wherein a sheath formed in the step (2) is thicker than a sheath formed in the step (3).
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