SUBSTRATE INSPECTION METHOD AND A SUBSTRATE PROCESSING METHOD

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United States of America Patent

SERIAL NO

14326076

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Abstract

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There is provided a substrate inspection method. The method includes: maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; positioning the substrate on a stage in the inspection chamber; selecting an evaluation parameter according to a kind of said processing apparatus; and determining inspection regions of the substrate so that an inspection time required per a lot of the substrate is equal to a processing time spent for said processing step required per a lot of the substrate. The method also includes radiating a primary electron beam from an electron gun; deflecting the primary electron beam with an E*B unit; irradiating said inspection regions of the substrate with the deflected primary electron beam; and projecting secondary electrons emitted from said substrate through the E*B unit onto a detector with a secondary optical system.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATIONJAPAN TOKYO DAEJEON HANEDA XU TING NO 11 NO 1

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatakeyama, Masahiro Fujisawa-shi, JP 112 2190
Karimata, Tsutomu Yokohama-shi, JP 68 1953
Kimba, Toshifumi Fujisawa-shi, JP 91 1870
Murakami, Takeshi Tokyo, JP 273 5723
Nakasuji, Mamoru Yokohama-shi, JP 144 2938
Noji, Nobuharu Zushi-shi, JP 107 2712
Oowada, Shin Yokohama-shi, JP 36 1124
Saito, Mutsumi Yokohama-shi, JP 45 1242
Satake, Tohru Chigasaki-shi, JP 99 2461
Sobukawa, Hirosi Zama-shi, JP 54 1854
Watanabe, Kenji Fujisawa-shi, JP 546 8684
Yoshikawa, Shoji Tokyo, JP 90 2421

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