SUBSTRATE INSPECTION METHOD AND A SUBSTRATE PROCESSING METHOD

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United States of America Patent

SERIAL NO

14326076

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Abstract

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There is provided a substrate inspection method. The method includes: maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; positioning the substrate on a stage in the inspection chamber; selecting an evaluation parameter according to a kind of said processing apparatus; and determining inspection regions of the substrate so that an inspection time required per a lot of the substrate is equal to a processing time spent for said processing step required per a lot of the substrate. The method also includes radiating a primary electron beam from an electron gun; deflecting the primary electron beam with an E*B unit; irradiating said inspection regions of the substrate with the deflected primary electron beam; and projecting secondary electrons emitted from said substrate through the E*B unit onto a detector with a secondary optical system.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 144-8510

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatakeyama, Masahiro Fujisawa-shi, JP 111 2104
Karimata, Tsutomu Yokohama-shi, JP 67 1864
Kimba, Toshifumi Fujisawa-shi, JP 89 1796
Murakami, Takeshi Tokyo, JP 270 5244
Nakasuji, Mamoru Yokohama-shi, JP 144 2835
Noji, Nobuharu Zushi-shi, JP 107 2599
Oowada, Shin Yokohama-shi, JP 33 1082
Saito, Mutsumi Yokohama-shi, JP 45 1198
Satake, Tohru Chigasaki-shi, JP 99 2348
Sobukawa, Hirosi Zama-shi, JP 54 1764
Watanabe, Kenji Fujisawa-shi, JP 537 8338
Yoshikawa, Shoji Tokyo, JP 89 2332

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