Methods for establishing thermal joints between heat spreaders or lids and heat sources

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United States of America Patent

PATENT NO 10373891
APP PUB NO 20140367847A1
SERIAL NO

14294973

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

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Patent Owner(s)

  • LAIRD TECHNOLOGIES, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hill, Richard F Parkman, US 44 909
Strader, Jason L Cleveland, US 44 407

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