Fluidic module permanent stack assemblies and methods

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9446378
APP PUB NO 20140369902A1
SERIAL NO

14361842

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides an assembled stack of fluidic modules comprising at least first and second fluidic modules assembled in a stacked configuration. The first fluidic module has first and second major planar surfaces and encloses a first fluidic passage extending therethrough from a first passage entrance to a first passage exit with the first passage exit located on the second major planar surface of the first fluidic module. The second fluidic module also has first and second major planar surfaces and encloses a second fluidic passage extending therethrough from a second passage entrance to a second passage exit, with the second passage entrance located on the first major planar surface of the second fluidic module. The second major planar surface of the first fluidic module and the first major planar surface of the second fluidic module are spaced apart and physically joined together by at least three separate glass or glass-ceramic pads fused therebetween, and the at least three pads include at least one pad having no through-hole and at least one pad having a through-hole, with the through-hole forming a sealed fluidic interconnection between the first fluidic passage and the second fluidic passage. A method of forming the assembled stack is also disclosed.

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Patent Owner(s)

  • CORNING INCORPORATED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dannoux, Thierry Luc Alain Avon, FR 116 1229
Gremetz, Sylvain Maxime F Montereau Fault Yonne, FR 13 18
Lobet, Olivier Villiers sous Grez, FR 24 80
Tanguy, Ronan Grez sur Loing, FR 20 94

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