COMPOSITION FOR PREPARING A BONDING MATERIAL AND USES THEREOF

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United States of America Patent

APP PUB NO 20140370265A1
SERIAL NO

14345100

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention discloses a composition for preparing a bonding material for use in a circuit board comprising a polymerizable acrylate system and a curable epoxy resin system, the composition being photocurable. The present invention also provides a circuit board comprising the bonding material.

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Patent Owner(s)

Patent OwnerAddress
3M INNOVATIVE PROPERTIES COMPANYP O BOX 33427 ST PAUL MN 55133-3427

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Justina S Singapore, SG 2 1
Ouderkirk, Andrew J St. Paul, US 416 16364
Plaut, David J St. Paul, US 15 231
Song, Hyung-Jin Seoul, KR 3 11

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