WAFER ALIGNMENT AND BONDING TOOL FOR 3D INTEGRATION
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United States of America Patent
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Issued Date -
Dec 18, 2014
app pub date -
Jun 18, 2013
filing date -
Jun 18, 2013
priority date (Note) -
Abandoned
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Abstract
A bonding apparatus for 3D integration may include a plurality of infrared microscopes that emit and receive infrared light for imaging, a first bonding chuck that holds a first semiconductor structure, and a second bonding chuck that holds a second semiconductor structure, whereby the second bonding chuck has a plurality of openings that are transparent to the received infrared light. A force pin is coupled to the first bonding chuck for applying a predetermined force to the first semiconductor structure for bonding to the second semiconductor structure. A temperature controller is coupled to the second bonding chuck, whereby the temperature controller applies a predetermined temperature to the second semiconductor structure, such that, prior to the bonding, the first and the second semiconductor structure are de-aligned with respect to each other using the plurality of infrared microscopes and the plurality of openings. The de-alignment is based on the predetermined force and the application of the predetermined temperature.
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