FORMULATION FOR ACIDIC WET CHEMICAL ETCHING OF SILICON WAFERS
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United States of America Patent
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Dec 18, 2014
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Aug 22, 2012
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Aug 22, 2011
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Abstract
Acid etch compositions for etching multicrystalline silicon substrates are disclosed which may include hydrofluoric acid, an oxidizer, an acid diluent, and soluble silicon. The soluble silicon may be hexafluorosilicic acid or ammonium fluorosilicate. Silicon substrates patterned with organic resist may be used with the acid etch compositions for selective silicon patterning for solar cell applications.
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