Metal-clad laminate and printed wiring board
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United States of America Patent
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May 23, 2017
Grant Date -
Dec 25, 2014
app pub date -
Nov 29, 2012
filing date -
Dec 16, 2011
priority date (Note) -
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Abstract
A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.
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