DRY FILM, LAYERED STRUCTURE, PRINTED WIRING BOARD, AND PROCESS FOR PRODUCING LAYERED STRUCTURE
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United States of America Patent
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Issued Date -
Dec 25, 2014
app pub date -
Dec 25, 2012
filing date -
Dec 27, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention provides a dry film which can obtain a solder resist having an excellent resolution while maintaining various characteristics including PCT resistance, a laminated structure such as a printed writing board, and a method of producing the laminated structure.
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