PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140374153A1
SERIAL NO

14149831

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A PCB includes at least three single layer circuit boards laminated together. The single layer circuit boards include two outer circuit boards and at least one inner circuit board. Each single layer circuit board includes a dielectric layer and a conductive layer on a surface of the dielectric layer. The dielectric layer is selected from a material of thermoplastic resin. Each single layer circuit board defines at least one blind hole passing through the dielectric layer and is ended at the conductive layer. Each blind hole is filled with a filler material electrically connected to the conductive layer. The conductive layer of the at least one inner circuit board forms a first conductive circuit pattern, and the conductive layers of the outer circuit boards each form a second conductive circuit pattern. The second conductive circuit pattern is electrically connected to the first conductive circuit pattern by the filler material.

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Patent Owner(s)

Patent OwnerAddress
FUKUI PRECISION COMPONENT (SHENZHEN) CO LTDSHENZHEN
ZHEN DING TECHNOLOGY CO LTDNO 6 LANE 28 SAN HO RD SAN SHI VILLAGE TAYUAN TAOYUAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, YU-HSIEN New Taipei, TW 13 28
LIU, RUI-WU Shenzhen, CN 19 16
ZHONG, FU-WEI Shenzhen, CN 6 8

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