COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL
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United States of America Patent
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Issued Date -
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app pub date -
Jun 6, 2014
filing date -
Aug 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of attaching a die to a carrier using a temporary attach material is disclosed. The method comprises attaching the temporary attach material between a surface of the die and a surface of the carrier. The temporary attach material attaches the die to the carrier. The method comprises bonding at least one connector to the die and the carrier. The connector includes a first end bonded to the carrier and a second end bonded to the die. The method further comprises encapsulating at least a portion of the die and at least a portion of the at least one connector by an encapsulation material.
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