Heat-Transfer Device

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United States of America Patent

APP PUB NO 20150000881A1
SERIAL NO

14308888

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention includes a micro porous layer and a plurality of heat-transfer enhancing structures on a surface of the heat transfer tube in contact with the cold fluid. The heat-transfer enhancing structures have a height H that satisfies a relationship to a flow characteristic length D of 0.05>H/D≧0.01, and a relationship to an installation clearance L between the heat-transfer enhancing structures in a flow direction of 40

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTD6-6 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KAWAMURA, Toshinori Tokyo, JP 12 71
KITOU, Kazuaki Tokyo, JP 7 28
NAKANO, Hiroshi Tokyo, JP 377 4094
TAMURA, Akinori Tokyo, JP 25 295

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