MULTILAYER PRINTED CIRCUIT BOARD HAVING ANISOTROPY CONDICTIVE FILM AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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N/A
Issued Date -
Jan 1, 2015
app pub date -
Jun 27, 2014
filing date -
Jun 27, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A multilayer printed circuit board (PCB) includes a first and second PCB component, and an anisotropic conductive film (ACF). The first PCB component includes a first base isolative layer, additional circuited layers and isolative layers alternately stacked on the first base isolative layer, and a number of conductive posts protruding out of the first base isolative layer away from the additional circuited layers and the isolative layers. The second PCB component includes a second base isolative layer, additional circuited layers and isolative layers alternately stacked on the second base isolative layer, and a number of pads are formed on the second base isolative layer opposite to the additional layers and the isolative layers. Each conductive post is aligned with one of the pads. The ACF is sandwiched between and bonds the first base isolative layer and the second base isolative layer together.
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