APPARATUS AND METHODS FOR JOINING DISSIMILAR MATERIALS
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United States of America Patent
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app pub date -
Sep 16, 2014
filing date -
Dec 21, 2011
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Abandoned
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Abstract
An apparatus is provided including: at least one first sheet comprising a first material; at least one second sheet comprising a second material, wherein the first material comprises at least one of: a thermal conductivity and an electrical conductivity that is at least 10% lower than that of the second material; and a joint comprising at least one resistance spot weld (RSW), wherein the first sheet is at least about 1.5 times the thickness of the second sheet. Methods are also provided.
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