Emanation system and method for use

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United States of America Patent

PATENT NO 9522209
SERIAL NO

14309549

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An emanation system is disclosed that include a substrate, a secondary substrate, and an air treatment material. The secondary substrate is adapted to be wetted with runoff from the air treatment material applied to the substrate. When applied, the air treatment material emanates from the substrate at a first release rate and from the secondary substrate at a second release rate.

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Patent Owner(s)

  • S.C. JOHNSON & SON, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Fei Chicago, US 189 1193
Meier, Maude Christian Racine, US 10 244
Yuhas, Randy C Union Grove, US 4 10

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