Leadframe pocket

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9059154
APP PUB NO 20150001693A1
SERIAL NO

13932756

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A package structure and methods of manufacturing the same are disclosed. The package structure corresponds, in one example, to a transceiver module having a substrate with a pocket formed therein. The pocket is configured to receive one or multiple parts of a leadframe and helps reduce the amount of wire bonding required to connect the leadframe or components mounted thereon to traces on the substrate.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Seng-Kum Santa Clara, US 37 390
Meadowcroft, David San Jose, US 14 82
Murphy, Matt Sunnyvale, US 5 7

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