Power Modules with Parylene Coating
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United States of America Patent
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Issued Date -
Jan 1, 2015
app pub date -
Jun 28, 2013
filing date -
Jun 28, 2013
priority date (Note) -
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Abstract
A module includes a base plate, a substrate having a first metallized side attached to the base plate and an opposing second metallized side, a power semiconductor die attached to the second metallized side of the substrate at a first side of the die, a first plurality of electrical connections between the second metallized side of the substrate and a second side of the die opposing the first side of the die, and a housing attached to a periphery of the base plate. The housing and base plate enclose the die and the first electrical connections. A second plurality of electrical connections extend from the second metallized side of the substrate through the housing to provide external electrical connections for the module. A parylene coating prevents gases and humidity from reaching the die, the first electrical connections, and the first metallized side of the substrate.
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