Package assembly for embedded die and associated techniques and configurations

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9685414
APP PUB NO 20150001731A1
SERIAL NO

13928179

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Embodiments of the present disclosure are directed towards a package assembly for embedded die and associated techniques and configurations. In one embodiment, an apparatus includes a package assembly comprising a die attach layer, a die coupled with the die attach layer, the die having an active side including active devices of the die and an inactive side disposed opposite to the active side, a reinforced plate coupled with the die attach layer, the reinforced plate having a first side and a second side disposed opposite to the first side and a cavity disposed in the reinforced plate and one or more build-up layers coupled with the second side of the reinforced plate, the one or more build-up layers including an insulator and conductive features disposed in the insulator, the conductive features being electrically coupled with the die, wherein the inactive side of the die is in direct contact with the die attach layer, the first side of the reinforced plate is in direct contact with the die attach layer and the die is disposed in the cavity. Other embodiments may be described and/or claimed.

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First Claim

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shuto, Takashi Tsukuba, JP 11 168

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