Reliable microstrip routing for electronics components
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United States of America Patent
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May 26, 2015
Grant Date -
Jan 1, 2015
app pub date -
Jun 28, 2013
filing date -
Jun 28, 2013
priority date (Note) -
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Abstract
A semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.
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