Shielded sockets for microprocessors and fabrication thereof by overmolding and plating
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United States of America Patent
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Nov 3, 2015
Grant Date -
Jan 1, 2015
app pub date -
Jun 28, 2013
filing date -
Jun 28, 2013
priority date (Note) -
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Abstract
Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.
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