Importance

Loading Importance Indicators...

Abstract

A putty-like heat transfer material of the present invention includes heat conductive particles dispersed in an organopolysiloxane. The organopolysiloxane is a silicone sol produced by partially crosslinking a base polymer (a) with a crosslinking component (b). The base polymer (a) includes an organopolysiloxane that contains an average of two or more alkenyl groups each bound to a silicon atom located at a terminal of a molecular chain in a molecule. The crosslinking component (b) includes an organopolysiloxane that contains an average of two or more hydrogen atoms each bound to a silicon atom in a molecule, and the partial crosslinking is carried out at such a ratio that the amount of the crosslinking component (b) is less than 1 mol with respect to 1 mol of the alkenyl groups bound to silicon atoms contained in the component (a). Thus, the present invention provides a putty-like heat transfer material that can exhibit favorable fluidity even when a large amount of inorganic particulate filler is added, that can be extruded readily through a tube or a syringe, and that can have a self shape retention when being allowed to stand. The present invention provides also a method for producing the putty-like heat transfer material.

Loading the Abstract Image...

First Claim