Substrate warpage control using external frame stiffener

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United States of America Patent

PATENT NO 9355966
APP PUB NO 20150008571A1
SERIAL NO

13937040

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Abstract

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A chip package and methods of manufacturing the same are disclosed. In particular, a chip package comprising a ball grid array is disclosed in which the chip package includes a package substrate supporting the ball grid array and in which the chip package further includes a warpage control frame that helps to minimize or mitigate warpage of the chip package.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dauksher, Walter J Fort Collins, US 5 56
Gallegos, Adam Fort Collins, US 4 30

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