PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET

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United States of America Patent

APP PUB NO 20150010754A1
SERIAL NO

14369276

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Abstract

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A pressure-sensitive adhesive of the present invention comprises a (meth)acryl-based polymer obtained by polymerization of a monomer component containing 40 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and more than 0 to 50% by weight or less of an alicyclic structure-containing monomer. The pressure-sensitive adhesive is capable of forming a pressure-sensitive adhesive layer that has a sufficiently low level of dielectric constant and a satisfactory level of adhesion performance.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONIBARAKI-SHI OSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higashi, Masatsugu Ibaraki-shi, JP 17 52
Iseki, Azusa Ibaraki-shi, JP 10 32
Kamiya, Katsuhiko Ibaraki-shi, JP 32 222
Tanaka, Akiko Ibaraki-shi, JP 92 550

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