Method for forming biochips and biochips with non-organic landings for improved thermal budget

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United States of America Patent

PATENT NO 10145847
APP PUB NO 20150011021A1
SERIAL NO

14497151

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Abstract

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The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Allen Timothy Hsin-chu, TW 37 270
Chang, Yi-Hsien Shetou Township, TW 60 943
Chen, Ching-Ray Taipei, TW 15 262
Cheng, Chun-Ren Hsin-Chu, TW 128 1344
Cheng, Chun-Wen Zhubei, TW 259 3778
Chu, Chia-Hua Zhubei, TW 192 2736
Liu, Yi-Shao Zhubei, TW 68 1092

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