Curing System and Method
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Jun 30, 2014
filing date -
Jul 15, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system including a curing system, including a first heating section, wherein the first heating section is configured to heat a device with a first radiant heat source, a second heating section coupled to the first heating section, wherein the second heating section is configured to heat the device with a second radiant heat source, and a controller system, configured to control the first and second heating sections based on a thermal curing profile for the device.
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