PHOTOSENSITIVE COMPOSITION, HARDENED COATING FILMS THEREFROM, AND PRINTED WIRING BOARDS USING SAME
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Apr 4, 2012
filing date -
Apr 8, 2011
priority date (Note) -
Abandoned
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Abstract
Provided is a photosensitive composition, which comprises a carboxyl group-containing resin, a photopolymerization initiator, a photosensitive acrylate compound and a filler, wherein the filler has a refractive index of 1.5 to 1.6 and a dry coating film of the photosensitive composition shows an absorbance of at least either 0.01 to 0.2 at a wavelength of 365 nm or 0.01 to 0.2 at a wavelength of 405 nm per thickness of 25 μm. The content of the filler is preferably 20 to 60 wt % with respect to the total amount of the composition. This photosensitive composition can be advantageously used as a plating resist of a printed wiring board or a solder resist and is useful particularly in the formation of a very finely patterned resist film having a high aspect ratio.
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