Composition for forming silver ion diffusion-suppressing layer, film for silver ion diffusion-suppressing layer, circuit board, electronic device, conductive film laminate, and touch panel
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United States of America Patent
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Feb 21, 2017
Grant Date -
Jan 15, 2015
app pub date -
Aug 25, 2014
filing date -
Feb 28, 2012
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Abstract
A composition for forming a silver ion diffusion-suppressing layer includes an insulating resin and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with the total number of carbon atoms in the hydrocarbon group or groups being 5 or more. The composition for forming a silver ion diffusion-suppressing layer allows formation of a silver ion diffusion-suppressing layer capable of suppressing silver ion migration between metal interconnects containing silver or a silver alloy to improve the reliability on the insulation between the metal interconnects.
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