METHOD FOR PRODUCING MATT COPPER DEPOSITS
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United States of America Patent
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Jan 15, 2015
app pub date -
Nov 27, 2012
filing date -
Jan 25, 2012
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Abstract
The present invention relates to a method for deposition of a matte copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic compound comprising divalent sulfur. A second copper layer is then deposited onto the first copper layer from an aqueous copper electrolyte comprising a first and a second water soluble sulfur-containing additive wherein the first water soluble sulfur-containing compound is an alkyl sulfonic acid derivative and the second water soluble sulfur-containing additive is an aromatic sulfonic acid derivative. The method provides copper layers with a homogeneous and adjustable matte appearance for decorative applications.
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