ETCHING LIQUID FOR FORMING TEXTURE
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Feb 6, 2013
filing date -
Feb 8, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In the present invention, by using an etching liquid for silicon wafers, which comprises an aqueous solution containing (A) an alkali component and (B) a phosphonic acid derivative or a salt thereof, a good texture can be stably and uniformly formed on a wafer surface. The present invention provides a texture-forming etching liquid for silicon wafers, which is applicable to both wafers cut by a loose abrasive grain system and wafers cut by a fixed abrasive grain system with no vaporization of additive components in the region of working temperatures of from 60° C. to 95° C.
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