Multipath electrical probe and probe assemblies with signal paths through secondary paths between electrically conductive guide plates
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United States of America Patent
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Nov 20, 2018
Grant Date -
Jan 15, 2015
app pub date -
Jul 9, 2014
filing date -
Jul 9, 2013
priority date (Note) -
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Abstract
A multiple conduction path probe can provide an electrically conductive signal path from a first contact end to a second contact end. The probe can also include an electrically conductive secondary path and an electrically insulated gap between the signal path and the secondary path. A probe assembly can comprise multiple such probes disposed in passages in substantially parallel electrically conductive guide plates. In some configurations, the probe assembly can include one or more secondary probes disposed in passages of the conductive guide plates and electrically connected to one or both of the guide plates. Some of the probes can be electrically insulated from the guide plates and thus provide signal paths, and others of the probes can be electrically connected to the guide plates and thus provide secondary paths.
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