CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
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United States of America Patent
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N/A
Issued Date -
Jan 15, 2015
app pub date -
Feb 27, 2014
filing date -
Jul 10, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A circuit module includes a wiring substrate, an electronic component, a sealing layer, and a conductive shield. The wiring substrate has a mount surface. The electronic component is mounted on the mount surface. The sealing layer is formed of an insulating material, covers the electronic component, and has a first surface and a second surface, the first surface being opposite to the mount surface and having a first sealing area and a second sealing area, the second sealing area projecting from the first sealing area to an opposite side of the mount surface, the second surface being connected to the mount surface and the first surface. The conductive shield covers at least the second surface and the first sealing area of the first surface.
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