METHOD OF MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT AND APPARATUS FOR MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Jan 15, 2015
app pub date -
Nov 8, 2012
filing date -
Mar 7, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is to provide a method of manufacturing a resin-encapsulated electronic component and an apparatus for manufacturing a resin-encapsulated electronic component that enable the manufacture of a resin-encapsulated electronic component including a plate-like member in a simple manner at low cost. The method of manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component including a plate-like member 13, the method includes: placing a resin 15 on the plate-like member 13; transferring the resin 15 to a position of a die cavity 17a of a molding die in a state where the resin 15 is placed on the plate-like member 13; and performing resin-encapsulation of an electronic component by subjecting the resin 15 to compression molding together with the plate-like member 13 and the electronic component in a state where the electronic component is soaked in the resin 15 placed on the plate-like member 13 in the die cavity 17a.
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