HOT-MELT ADHESIVE COMPOSITION

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United States of America Patent

APP PUB NO 20150018470A1
SERIAL NO

14380454

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Abstract

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The present invention provides a hot melt adhesive composition comprising (A) an ethylene copolymer obtained by copolymerizing ethylene and α-olefin using a single-site catalyst and (B) a rosin ester, in a hydrolyzate of which a dehydroabietic acid content is 30 wt % or less and an abietic acid content is 10 wt % or less, and in a methylated product of the hydrolyzate of which a content of components having a molecular weight of 320 is equal to or greater than 10 wt % of a total amount of components having a molecular weight of 314 to 320.

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Patent Owner(s)

Patent OwnerAddress
ARAKAWA CHEMICAL INDUSTRIES LTDOSAKA JAPAN OSAKA-SHI OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakatani, Takashi Osaka-shi, JP 15 69

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